Circuit board manufacturers tell you the difference between gold and gold
2021-11-15
With the increasing integration of IC, IC feet are more and more dense. The vertical tin-spraying process is difficult to blow a thin pad flat, which brings difficulty to SMT mounting; In addition, the service life of the tin spray plate is very short. And the gold-plated circuit board is a good solution to these problems.
Circuit board manufacturers tell you the difference between gold and gold15-11 2021
Metallized board and metallized board are common processes in circuit board production today.
With the increasing integration of IC, IC feet are more and more dense. The vertical tin-spraying process is difficult to blow a thin pad flat, which brings difficulty to SMT mounting; In addition, the service life of the tin spray plate is very short. And the gold-plated circuit board is a good solution to these problems. For the surface mount process, especially for the ultra-small sheet, because the flatness of the pad is directly related to the quality of the solder paste printing process, and has a decisive impact on the quality of the re-flow welding behind, the circuit board gold-plating is often seen in the high-density and ultra-small sheet paste process. In the trial production stage, affected by factors such as component procurement, the board is often not welded immediately, but often has to wait for a few weeks or even a few months to use, and the service life of the gold-plated board is many times longer than that of the tin board. So people are willing to adopt it. Moreover, the cost of the gold plating stage is almost the same as that of the lead-tin alloy plate.
" What is gold plating?
Gold plating refers to the distinction between electric gold plating, electroplated nickel gold plate, electrolytic gold, electric gold, electric nickel gold plate, soft gold and hard gold (generally used as gold fingers). |
The principle is to dissolve nickel and gold (commonly known as gold salt) in the chemical solution, the circuit board is immersed in the electroplating cylinder and the current is passed on the copper foil surface of the circuit board to generate nickel gold coating, electric nickel gold because of its coating hardness is high, wear resistance, not easy to oxidize the characteristics of electronic products have been widely used. |
What is gold
Gold deposition is through the chemical REDOX reaction method to generate a layer of coating, generally thicker, is a kind of chemical nickel gold deposit method, can reach a thicker gold layer, usually called gold deposition.
The difference between gold plating and gold plating
First, the crystal structure formed by the board gold plating is not the same as that of the board gold plating, the thickness of the gold plating is much thicker than that of the gold plating, the gold plating will be gold more yellow than the gold plating, and the customer is more satisfied.
Second, sinking gold is easier to weld than gold plating, and will not cause poor welding and cause customer complaints. The stress of the gold plate is easier to control, and it is more conducive to the processing of the bonded products. At the same time, because the sinking gold is softer than the gilding, the sinking gold plate is not wear-resistant to the goldfinger.
Third, there is only nickel gold on the solder pad, and the signal transmission in the skin effect is in the copper layer and will not affect the signal.
Fourth, the crystal structure of sunk gold is more dense than that of gold plating, and it is not easy to produce oxidation. Make process choices according to your needs for the product
Fifth, as the wiring becomes more and more dense, the line width and spacing have reached 3-4MIL. Gold plating is easy to produce gold wire short circuit. There is only nickel gold on the pad, so there is no short circuit of gold wire.
Six, the circuit board sinking plate only has nickel gold on the welding pad, so the welding resistance on the line is more firmly combined with the copper layer. The works will not affect the spacing when making compensation
Seven, generally used for relatively high requirements of the board, the flatness is better, generally the use of circuit board sinking gold, sinking gold generally does not appear after assembly of the black pad phenomenon. The flatness and service life of the sunken gold plate are as good as those of the gold-plated plate.
