Aluminum clad copper plate is a metal circuit board data, composed of copper foil, thermal insulation layer and metal substrate, its layout is divided into three layers:

Cireuitl.Layer Line layer: equivalent to the copper clad plate of the usual PCB, line copper foil thickness loz to 10oz.

Dielcctric Layer Insulation: An insulation layer is a layer of low thermal resistance thermal insulation material. Thickness: 0.003 "to 0.006" is the core measurement site of aluminum-based copper-clad panels, which are UL certified.

　　Base Layer: A metal substrate, usually aluminum or optionally copper. Aluminum based copper clad plate and traditional epoxy glass cloth laminate and so on.

　　PCB aluminum substrate is composed of circuit layer, thermal insulation layer and metal bottom layer. The circuit layer (that is, copper foil) usually constitutes a printed circuit by etching, so that the various components of the component are connected to each other, usually, the circuit layer needs to have a great current carrying ability, so a thicker copper foil should be used, the thickness is usually 35μm~280μm; The thermal insulation layer is the location of the core skills of PCB aluminum substrate, which is usually composed of a special polymer filled with special ceramics, with small thermal resistance, excellent viscoelastic function, and the ability to resist thermal aging and accept mechanical and thermal stress. T-101, T-111, T-112, T-113, T-114 and T-200, T-300, T-400, T-500, T-600 and other high-function PCB aluminum substrate thermal insulation layer is the use of this skill, so that it has excellent thermal conductivity and high-strength electrical insulation function; The metal bottom is the support member of the aluminum substrate, the need for high thermal conductivity, usually aluminum substrate, can also use copper plate (copper plate can provide very good thermal conductivity), suitable for drilling, punching and cutting and other conventional mechanical processing. PCB data comparison has the advantage that other data can not be compared. Suitable power components external mount SMT public art. No need for heat sink, the volume is greatly reduced, the heat dissipation effect is excellent, outstanding insulation function and mechanical function. 

　  Aluminum substrate used　　

One. Audio equipment: input, output amplifier, balance amplifier, audio amplifier, preamplifier, power amplifier, etc.

Two. Power equipment: switch regulator, DC/AC converter, SW regulator, etc.

Three. Communication electronic equipment: high-frequency amplifier 'filter electrical' transmitting circuit.

Four. Office automation equipment: motor drives, etc.

Five. Automobile: electronic regulator, igniter, power controller, etc.

Six. Computer: CPU board, floppy disk drive, power supply equipment, etc.

Seven. Power module: converter, solid relay, rectifier bridge, etc.

Eight. Lamp lighting: With the launch of energy-saving lamps, aluminum substrates used in LED lights have also begun to be used on a large scale.

Characteristics of aluminum substrate

One. Use surface mount technology (SMT);

Two. Extremely useful treatment of thermal diffusion in circuit design;

Three. Reduce the operating temperature of the commodity, improve the power density and reliability of the commodity, and extend the service life of the commodity;

Four. Reduce the volume of goods, reduce hardware and installation costs;

Five. Replace the fragile ceramic substrate to achieve very good mechanical durability.